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technical details I |  |
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| I Need Earthing Solutions For A Low Voltage / Medium Voltage Equipment | ||||
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Model T-19 50MM Dia For LV/MV applications (In place of conventional GI pipe earthing) Test conducted, short time current : 5kA rms/1 sec CPRI, Bangalore. |
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| Length | : | 3000MM (3Meter) / 2000MM (2-Meter)* | ||
| Outer Electrode Dia | : | 50MM | ||
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Inner Electrode Dia | : | 25MM | |
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Terminal Hole Dia | : | 12MM | |
| Outer Electrode Wall Thickness | : | 18swg (1.219mm) | ||
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Inner Electrode Wall Thickness | : | 12swg (2.641mm) | |
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Hot dip | : | Outer Electrode 70-100 Microns | |
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Galvanization | : | Inner Electrode 200-250 Microns | |
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Space inside Electrode | : | Tightly filled with Crystalline Conductor Mixture | |
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*2000MM (2-Meter) | : | Where auguring is not possible up to 3 Meters, Two 2-Meter Electrodes are installed and interconnected | |
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technical details II | |
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I Need Earthing For A High Voltage Equipment |
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Model T-39 80MM Dia For HV/EHV applications (In place of conventional Copper Plate Earthing) Test conducted, short time current : 25kA rms/1 sec CPRI, Bangalore. |
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| Length | : | 3000MM (3Meter) / 2000MM (2-Meter)* | ||
| Outer Electrode Dia | : | 76MM | ||
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Inner Electrode Dia | : | 38MM | |
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Terminal Hole Dia | : | 12MM | |
| Outer Electrode Wall Thickness | : | 16swg (1.626mm) | ||
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Inner Electrode Wall Thickness | : | 12swg (2.641mm) | |
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Hot dip | : | Outer Electrode 70-100 micron | |
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Galvanization | : | Inner Electrode 200-250 micron | |
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Space inside Electrode | : | Tightly filled with Crystalline Conductor Mixture | |
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*2000MM (2-Meter) | : | where auguring is not possible up to 3 Meters, Two 2-Meter Electrodes are installed and interconnected. | |
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